Publication: Technological Pedagogical Content Knowledge (TPACK) for pedagogical improvement: Editorial for special issue on TPACK
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Date
2015
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Springer
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Koh, J. H. L., Chai, C. S., & Lee, M. H. (2015). Technological Pedagogical Content Knowledge (TPACK) for pedagogical improvement: Editorial for special issue on TPACK. The Asia-Pacific Education Researcher, 24(3), 459–462. https://doi.org/10.1007/s40299-015-0241-6